Skip to content Hybrid Placer i-Cube10 Overview
Hybrid Placer i-Cube10 Overview
- Hybrid mounting
Realize mixed mounting of semiconductor and SMD - High-speed and high-accuracy mounting
±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions - Upgraded component supply
Intelligent feeder - Handling Large PCBs
L330 x W250mm