Hybrid Placer i-Cube10 Overview

Hybrid Placer i-Cube10 Overview

Hybrid Placer i-Cube10
  • Hybrid mounting
    Realize mixed mounting of semiconductor and SMD
  • High-speed and high-accuracy mounting
    ±15μm(Cpk≧1.0) CPH10,800(when die is supplied from wafer) Note: under optimum conditions
  • Upgraded component supply
    Intelligent feeder
  • Handling Large PCBs
    L330 x W250mm